Cypress Computer Hardware CY7C2565KV18 User Manual

CY7C2561KV18, CY7C2576KV18  
CY7C2563KV18, CY7C2565KV18  
PRELIMINARY  
72-Mbit QDR™-II+ SRAM 4-Word Burst  
Architecture (2.5 Cycle Read Latency) with ODT  
Features  
Configurations  
Separate independent read and write data ports  
Supports concurrent transactions  
With Read Cycle Latency of 2.5 cycles:  
CY7C2561KV18 – 8M x 8  
550 MHz clock for high bandwidth  
CY7C2576KV18 – 8M x 9  
CY7C2563KV18 – 4M x 18  
CY7C2565KV18 – 2M x 36  
4-word burst for reducing address bus frequency  
Double Data Rate (DDR) interfaces on both read and write  
ports (data transferred at 1100 MHz) at 550 MHz  
Functional Description  
Available in 2.5 clock cycle latency  
The CY7C2561KV18, CY7C2576KV18, CY7C2563KV18, and  
CY7C2565KV18 are 1.8V Synchronous Pipelined SRAMs,  
equipped with QDR-II+ architecture. Similar to QDR-II archi-  
tecture, QDR-II+ architecture consists of two separate ports: the  
read port and the write port to access the memory array. The  
read port has dedicated data outputs to support read operations  
and the write port has dedicated data inputs to support write  
operations. QDR-II+ architecture has separate data inputs and  
data outputs to completely eliminate the need to “turn-around”  
the data bus that exists with common IO devices. Each port is  
accessed through a common address bus. Addresses for read  
and write addresses are latched on alternate rising edges of the  
input (K) clock. Accesses to the QDR-II+ read and write ports are  
completely independent of one another. To maximize data  
throughput, both read and write ports are equipped with DDR  
interfaces. Each address location is associated with four 8-bit  
words (CY7C2561KV18), 9-bit words (CY7C2576KV18), 18-bit  
words (CY7C2563KV18), or 36-bit words (CY7C2565KV18) that  
burst sequentially into or out of the device. Because data is trans-  
ferred into and out of the device on every rising edge of both input  
clocks (K and K), memory bandwidth is maximized while simpli-  
fying system design by eliminating bus “turn-arounds”.  
Two input clocks (K and K) for precise DDR timing  
SRAM uses rising edges only  
Echo clocks (CQ and CQ) simplify data capture in high-speed  
systems  
Data valid pin (QVLD) to indicate valid data on the output  
On-Die Termination (ODT) feature  
Supported for D  
, BWS  
, and K/K inputs  
[x:0]  
[x:0]  
Single multiplexed address input bus latches address inputs  
for read and write ports  
Separate port selects for depth expansion  
Synchronous internally self-timed writes  
QDR™-II+ operates with 2.5 cycle read latency when DOFF is  
asserted HIGH  
Operates similar to QDR-I device with 1 cycle read latency  
when DOFF is asserted LOW  
Available in x8, x9, x18, and x36 configurations  
These devices have an On-Die Termination feature supported  
Full data coherency, providing most current data  
for D  
, BWS  
, and K/K inputs, which helps eliminate  
[x:0]  
[x:0]  
Core V = 1.8V± 0.1V; IO V  
= 1.4V to V  
DD  
external termination resistors, reduce cost, reduce board area,  
and simplify board routing.  
DD  
DDQ  
Supports both 1.5V and 1.8V IO supply  
Depth expansion is accomplished with port selects, which  
enables each port to operate independently.  
HSTL inputs and variable drive HSTL output buffers  
Available in 165-Ball FBGA package (13 x 15 x 1.4 mm)  
Offered in both Pb-free and non Pb-free packages  
JTAG 1149.1 compatible test access port  
All synchronous inputs pass through input registers controlled by  
the K or K input clocks. All data outputs pass through output  
registers controlled by the K or K input clocks. Writes are  
conducted with on-chip synchronous self-timed write circuitry.  
Phase Locked Loop (PLL) for accurate data placement  
Table 1. Selection Guide  
Description  
550 MHz  
550  
500 MHz  
500  
450 MHz  
450  
400 MHz  
400  
Unit  
MHz  
mA  
Maximum Operating Frequency  
Maximum Operating Current  
x8  
x9  
900  
830  
760  
690  
900  
830  
760  
690  
x18  
x36  
920  
850  
780  
710  
1310  
1210  
1100  
1000  
Note  
1. The Cypress QDR-II+ devices surpass the QDR consortium specification and can support V  
= 1.4V to V  
.
DD  
DDQ  
Cypress Semiconductor Corporation  
Document Number: 001-15887 Rev. *E  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised April 24, 2009